Blog

The ChipsX Blog covers industry news, semiconductor trends, and global sourcing updates to help professionals stay informed in a fast-changing electronics market.

6G standardisation moves closer as 2026 begins

6G standardisation moves closer as 2026 begins

Feb 24, 2026

After several years of exploratory research, the global telecommunications industry is preparing for a more concrete phase in the development of sixth-generatio...

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Fibocom launches LTE Cat.1 bis module

Fibocom launches LTE Cat.1 bis module

Feb 24, 2026

Fibocom has introduced a global LTE Cat.1 bis cellular module aimed at simplifying worldwide IoT deployments through a single hardware SKU. The LE271-GL module ...

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Wi-Fi 7 IoT device targets low-power tri-radio connectivity

Wi-Fi 7 IoT device targets low-power tri-radio connectivity

Feb 24, 2026

Infineon Technologies has unveiled a tri-radio connectivity chip aimed at battery-powered and space-constrained connected devices. The ACW741x family integrates...

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ROHM expands nano cap LDO portfolio with 500 mA devices

ROHM expands nano cap LDO portfolio with 500 mA devices

Feb 22, 2026

ROHM has extended its Nano Cap linear regulator portfolio with a 500 mA LDO series aimed at applications that require stable regulation while using very small o...

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ROHM targets higher current sensing density with UCR10C shunt resistor series

ROHM targets higher current sensing density with UCR10C shunt resistor series

Feb 22, 2026

ROHM has introduced a 2012-size current sensing component designed to address rising power and reliability demands in automotive and industrial systems. The UCR...

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STM32V8 pushes 18nm microcontroller tech into new performance territory

STM32V8 pushes 18nm microcontroller tech into new performance territory

Feb 22, 2026

STMicroelectronics has introduced the STM32V8, the first microcontroller built on an 18-nm process, marking a major step forward for high-performance industrial...

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