Automotive

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ST launches fast-acting isolated gate drivers for compact automotive modules

Feb 25, 2026

STMicroelectronics has introduced two new automotive‑grade isolated gate drivers designed to support higher switching frequencies and improved efficiency in ele...

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Renesas unveils 3nm TCAM technology designed for high density and low power

Feb 25, 2026

Renesas Electronics has announced a new ternary content‑addressable memory (TCAM) technology built on a 3nm FinFET process.Offering higher memory density, reduc...

683 View

NXP unveils 10BASE‑T1S PMD transceivers to deliver ethernet at the edge

Feb 25, 2026

NXP Semiconductors has introduced what it says are the first production‑ready 10BASE‑T1S Physical Medium Dependent (PMD) transceivers, launching the TJA1410 for...

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ROHM targets higher current sensing density with UCR10C shunt resistor series

Feb 22, 2026

ROHM has introduced a 2012-size current sensing component designed to address rising power and reliability demands in automotive and industrial systems. The UCR...

953 View

Zone controller development kit: Infineon and Flex target SDVs at CES 2026

Feb 22, 2026

Infineon Technologies and Flex say they will launch a zone controller development kit at CES 2026, aimed at speeding up early hardware and software work for sof...

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Infineon’s CoolSiC MOSFETs power chosen for Toyota’s bZ4X

Feb 22, 2026

Infineon says its silicon carbide power semiconductors have been selected for Toyota’s new bZ4X battery-electric vehicle. The company’s CoolSiC MOSFETs will be ...

566 View